DIN Standards Catalogue
DIN EN 62258-2:2005
Semiconductor die products - Part 2: Exchange data formats (IEC 62258-2:2005); German version EN 62258-2:2005, text in English (FOREIGN STANDARD)
DIN EN 62007-2:2007
Semiconductor optoelectronic devices for fibre optic system applications - Part 2: Measuring methods (IEC 86C/771/CDV:2007); German version prEN 62007-2:2007 (FOREIGN STANDARD)
DIN EN 62007-1:2008
Semiconductor optoelectronic devices for fibre optic system applications - Part 1: Specification template for essential ratings and characteristics (IEC 86C/763/CDV:2007); German version prEN 62007-1:2007 (FOREIGN STANDARD)
DIN EN 61523-2:2003
Delay and power calculation standards - Part 2: Pre-layout delay calculation specification for CMOS ASIC libraries (IEC 61523-2:2002); German version EN 61523-2:2002, text in English (FOREIGN STANDARD)
DIN EN 61523-1:2002
Delay and power calculation standards - Part 1: Integrated circuit delay and power calculation systems (IEC 61523-1:2001); German version EN 61523-1:2002, text in English (FOREIGN STANDARD)
DIN EN 61249-4-17:2007
Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glas (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-4-16:2007
Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epox (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-4-15:2007
Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glas (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-4-14:2007
Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of def (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-2-38:2007
Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials clad and unclad - Non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertical burnin (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-2-37:2007
Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials clad and unclad - Modified non-halogenated epoxide woven E-glass laminated sheets of defined flammability (vertic (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-2-36:2007
Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper- (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-2-35:2007
Materials for printed boards and other interconnecting structures - Part 2-35: Reinforced base materials clad and unclad - Modified epoxide woven E-glass laminated sheets of defined flammability (vertical burning test) (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-2-34:2007
Materials for printed boards and other interconnecting structures - Part 2-34: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-gla (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-2-33:2007
Materials for printed boards and other interconnecting structures - Part 2-33: Reinforced base materials clad and unclad for high frequency application - Non-halogenated modified or unmodified resin system, woven E-gla (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-2-32:2007
Materials for printed boards and other interconnecting structures - Part 2-32: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass l (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61249-2-31:2007
Materials for printed boards and other interconnecting structures - Part 2-31: Reinforced base materials clad and unclad for high frequency application - Halogenated modified or unmodified resin system, woven E-glass l (TITLE TRUNCATED) (FOREIGN STANDARD)
DIN EN 61188-7:2007
Printed board and printed board assemblies - Design and use - Part 7: Sectional requirements - Electronic component zero orientation for CAD library construction (IEC 91/701/CDV:2007); German version prEN 61188-7:2007 (FOREIGN STANDARD)
DIN EN 60749-20:2007
Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 47/1916/CDV:2007); German version prEN 60749-20:2007 (FOREIGN STANDARD)
DIN EN 60603-7:2007
Connectors for electronic equipment - Part 7: Detail specification for 8-way, unshielded, free and fixed connectors (IEC 48B/1746/CDV:2007); German version prEN 60603-7:2007 (FOREIGN STANDARD)
DIN EN 60393-1:2007
Potentiometers for use in electronic equipment - Part 1: Generic specification (IEC 40/1799/CDV:2006); German version prEN 60393-1:2006 (FOREIGN STANDARD)
DIN EN 190000:1996
Generic specification: Monolithic integrated circuits (FOREIGN STANDARD)
DIN EN 140401:2008
Blank Detail Specification: Fixed low power non-wire-wound surface mount (SMD) resistors; German version FprEN 140401:2008 (Foreign Standard)
DIN 43460:1998
Contact assignment for circuit breakers rated for voltages lower than 52 kV - Assignment of auxiliary and control circuits to contact pins in plug connectors (FOREIGN STANDARD)
DIN 41622-1:1965
Multipole Connectors with Blade Contacts 3 ? 1 mm; Dimensions (FOREIGN STANDARD)DIN Standards Catalogue
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